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Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5

Hektor, Johan LU ; Ristinmaa, Matti LU ; Hallberg, Håkan LU ; Hall, Stephen LU and Iyengar, Srinivasan LU (2016) In Acta Materialia 108. p.98-109
Abstract
A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical... (More)
A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical simulations suggest that the thickness of the IMC layer increases linearly with time and that the morphology of the IMC gradually changes from scallop-like to planar, consistent with previous experimental findings. The model predicts that plastic deformation occurs in both the Cu and the Sn layers. Furthermore, the mean value of the biaxial stress in the Sn layer is found to saturate at a level of −8 MPa to −10 MPa during aging. This is in good agreement with experimental data. (Less)
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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Finite element method, Phase field model, Cu6Sn5, Intermetallic compounds
in
Acta Materialia
volume
108
pages
98 - 109
publisher
Elsevier
external identifiers
  • scopus:84959440236
  • wos:000374072700010
ISSN
1873-2453
DOI
10.1016/j.actamat.2016.02.016
language
English
LU publication?
yes
id
41497e79-d300-4271-bc17-21fab8bedad1 (old id 8771437)
date added to LUP
2016-03-18 12:58:22
date last changed
2017-01-01 03:04:36
@article{41497e79-d300-4271-bc17-21fab8bedad1,
  abstract     = {A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical simulations suggest that the thickness of the IMC layer increases linearly with time and that the morphology of the IMC gradually changes from scallop-like to planar, consistent with previous experimental findings. The model predicts that plastic deformation occurs in both the Cu and the Sn layers. Furthermore, the mean value of the biaxial stress in the Sn layer is found to saturate at a level of −8 MPa to −10 MPa during aging. This is in good agreement with experimental data.},
  author       = {Hektor, Johan and Ristinmaa, Matti and Hallberg, Håkan and Hall, Stephen and Iyengar, Srinivasan},
  issn         = {1873-2453},
  keyword      = {Finite element method,Phase field model,Cu6Sn5,Intermetallic compounds},
  language     = {eng},
  pages        = {98--109},
  publisher    = {Elsevier},
  series       = {Acta Materialia},
  title        = {Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5},
  url          = {http://dx.doi.org/10.1016/j.actamat.2016.02.016},
  volume       = {108},
  year         = {2016},
}