Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5
Hektor, Johan LU ; Ristinmaa, Matti LU
; Hallberg, Håkan
LU
; Hall, Stephen
LU
and Iyengar, Srinivasan
LU
(2016)
In Acta Materialia
108.
p.98-109
- Abstract
- A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical... (More)
- A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical simulations suggest that the thickness of the IMC layer increases linearly with time and that the morphology of the IMC gradually changes from scallop-like to planar, consistent with previous experimental findings. The model predicts that plastic deformation occurs in both the Cu and the Sn layers. Furthermore, the mean value of the biaxial stress in the Sn layer is found to saturate at a level of −8 MPa to −10 MPa during aging. This is in good agreement with experimental data. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/8771437
- author
- Hektor, Johan
LU
; Ristinmaa, Matti
LU
; Hallberg, Håkan
LU
; Hall, Stephen
LU
and Iyengar, Srinivasan
LU
- organization
- publishing date
- 2016
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Finite element method, Phase field model, Cu6Sn5, Intermetallic compounds
- in
- Acta Materialia
- volume
- 108
- pages
- 98 - 109
- publisher
- Elsevier
- external identifiers
-
- scopus:84959440236
- wos:000374072700010
- ISSN
- 1873-2453
- DOI
- 10.1016/j.actamat.2016.02.016
- project
- Tin whiskers: modeling and experiments
- language
- English
- LU publication?
- yes
- id
- 41497e79-d300-4271-bc17-21fab8bedad1 (old id 8771437)
- date added to LUP
- 2016-04-01 09:52:43
- date last changed
- 2022-04-11 23:45:16
@article{41497e79-d300-4271-bc17-21fab8bedad1,
abstract = {{A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical simulations suggest that the thickness of the IMC layer increases linearly with time and that the morphology of the IMC gradually changes from scallop-like to planar, consistent with previous experimental findings. The model predicts that plastic deformation occurs in both the Cu and the Sn layers. Furthermore, the mean value of the biaxial stress in the Sn layer is found to saturate at a level of −8 MPa to −10 MPa during aging. This is in good agreement with experimental data.}},
author = {{Hektor, Johan and Ristinmaa, Matti and Hallberg, Håkan and Hall, Stephen and Iyengar, Srinivasan}},
issn = {{1873-2453}},
keywords = {{Finite element method; Phase field model; Cu6Sn5; Intermetallic compounds}},
language = {{eng}},
pages = {{98--109}},
publisher = {{Elsevier}},
series = {{Acta Materialia}},
title = {{Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5}},
url = {{https://lup.lub.lu.se/search/files/1347615/8864410.pdf}},
doi = {{10.1016/j.actamat.2016.02.016}},
volume = {{108}},
year = {{2016}},
}