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High-k dielectrics on (100) and (110) n-InAs: Physical and electrical characterizations

Wang, C. H. ; Doornbos, G. ; Astromskas, G. ; Vellianitis, G. ; Oxland, R. ; Holland, M. C. ; Huang, M. L. ; Lin, C. H. ; Hsieh, C. H. and Chang, Y. S. , et al. (2014) In AIP Advances 4(4).
Abstract
Two high-k dielectric materials (Al2O3 and HfO2) were deposited on n-type (100) and (110) InAs surface orientations to investigate physical properties of the oxide/semiconductor interfaces and the interface trap density (D-it). X-ray photoelectron spectroscopy analyses (XPS) for native oxides of (100) and (110) as-grown n-InAs epi wafers show an increase in As-oxide on the (100) surface and an increase in InOx on the (110) surface. In addition, XPS analyses of high-k (Al2O3 and HfO2) on n-InAs epi show that the intrinsic native oxide difference between (100) and (110) epi surfaces were eliminated by applying conventional in-situ pre-treatment (TriMethyAluminium (TMA)) before the high-k deposition. The capacitance-voltage (C-V)... (More)
Two high-k dielectric materials (Al2O3 and HfO2) were deposited on n-type (100) and (110) InAs surface orientations to investigate physical properties of the oxide/semiconductor interfaces and the interface trap density (D-it). X-ray photoelectron spectroscopy analyses (XPS) for native oxides of (100) and (110) as-grown n-InAs epi wafers show an increase in As-oxide on the (100) surface and an increase in InOx on the (110) surface. In addition, XPS analyses of high-k (Al2O3 and HfO2) on n-InAs epi show that the intrinsic native oxide difference between (100) and (110) epi surfaces were eliminated by applying conventional in-situ pre-treatment (TriMethyAluminium (TMA)) before the high-k deposition. The capacitance-voltage (C-V) characterization of HfO2 and Al2O3 MOSCAPs on both types of n-InAs surfaces shows very similar C-V curves. The interface trap density (D-it) profiles show D-it minima of 6.1 x 10(12/)6.5 x 10(12) and 6.6 x 10(12)/7.3 x 10(12) cm(-2) eV(-1) for Al2O3 and HfO2, respectively for (100) and (110) InAs surfaces. The similar interface trap density (D-it) on (100) and (110) surface orientation were observed, which is beneficial to future InAs FinFET device with both (100) and (110) surface channel orientations present. (C) 2014 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution 3.0 Unported License. (Less)
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organization
publishing date
type
Contribution to journal
publication status
published
subject
in
AIP Advances
volume
4
issue
4
article number
047108
publisher
American Institute of Physics (AIP)
external identifiers
  • wos:000336082000025
  • scopus:84898452426
ISSN
2158-3226
DOI
10.1063/1.4871187
language
English
LU publication?
yes
id
a262d58d-01de-4356-9035-41274670484c (old id 4559281)
date added to LUP
2016-04-01 13:13:39
date last changed
2023-10-29 05:58:32
@article{a262d58d-01de-4356-9035-41274670484c,
  abstract     = {{Two high-k dielectric materials (Al2O3 and HfO2) were deposited on n-type (100) and (110) InAs surface orientations to investigate physical properties of the oxide/semiconductor interfaces and the interface trap density (D-it). X-ray photoelectron spectroscopy analyses (XPS) for native oxides of (100) and (110) as-grown n-InAs epi wafers show an increase in As-oxide on the (100) surface and an increase in InOx on the (110) surface. In addition, XPS analyses of high-k (Al2O3 and HfO2) on n-InAs epi show that the intrinsic native oxide difference between (100) and (110) epi surfaces were eliminated by applying conventional in-situ pre-treatment (TriMethyAluminium (TMA)) before the high-k deposition. The capacitance-voltage (C-V) characterization of HfO2 and Al2O3 MOSCAPs on both types of n-InAs surfaces shows very similar C-V curves. The interface trap density (D-it) profiles show D-it minima of 6.1 x 10(12/)6.5 x 10(12) and 6.6 x 10(12)/7.3 x 10(12) cm(-2) eV(-1) for Al2O3 and HfO2, respectively for (100) and (110) InAs surfaces. The similar interface trap density (D-it) on (100) and (110) surface orientation were observed, which is beneficial to future InAs FinFET device with both (100) and (110) surface channel orientations present. (C) 2014 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution 3.0 Unported License.}},
  author       = {{Wang, C. H. and Doornbos, G. and Astromskas, G. and Vellianitis, G. and Oxland, R. and Holland, M. C. and Huang, M. L. and Lin, C. H. and Hsieh, C. H. and Chang, Y. S. and Lee, T. L. and Chen, Y. Y. and Ramvall, Peter and Lind, Erik and Hsu, W. C. and Wernersson, Lars-Erik and Droopad, R. and Passlack, M. and Diaz, C. H.}},
  issn         = {{2158-3226}},
  language     = {{eng}},
  number       = {{4}},
  publisher    = {{American Institute of Physics (AIP)}},
  series       = {{AIP Advances}},
  title        = {{High-k dielectrics on (100) and (110) n-InAs: Physical and electrical characterizations}},
  url          = {{http://dx.doi.org/10.1063/1.4871187}},
  doi          = {{10.1063/1.4871187}},
  volume       = {{4}},
  year         = {{2014}},
}