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        - 2011
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                        Mark
        Test Scheduling and Test Access Optimization for Core-Based 3D Stacked ICs with Through-Silicon Vias: poster
    (2011) IEEE European Test Symposium (ETS), 2011
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
 
 - 2010
 - 
                        Mark
        A Distributed Architecture to Check Global Properties for Post-Silicon Debug
    (2010) IEEE European Test Symposium (ETS'10), 2010
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
 
 - 
                        Mark
        Optimizing Fault Tolerance for Multi-Processor System-on-Chip
    (2010)
- Chapter in Book/Report/Conference proceeding › Book chapter
 
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                        Mark
        Study on Combined Test-Data Compression and Test Planning for Testing of Modular SoCs
    (2010)
- Chapter in Book/Report/Conference proceeding › Book chapter
 
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                        Mark
        Efficient Embedding of Deterministic Test Data
    (2010) Swedish SoC Conference 2010
- Contribution to conference › Paper, not in proceeding
 
 - 
                        Mark
        Checking Pipelined Distributed Global Properties for Post-silicon Debug
    (2010) IEEE Eleventh Workshop on RTL and High Level Testing, 2010
- Contribution to conference › Paper, not in proceeding
 
 - 
                        Mark
        Test scheduling on IJTAG
    (2010) Nordic Test Forum (NTF 2010),
- Contribution to conference › Paper, not in proceeding
 
 - 
                        Mark
        Scan Cells Reordering to Minimize Peak Power During Test Cycle : A Graph Theoretic Approach
    
    
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
 
 - 
                        Mark
        Estimating Error-Probability and Its Application for Optimizing Roll-back Recovery with Checkpointing
    
    
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
 
 - 
                        Mark
        Scheduling Tests for Stacked 3D Chips under Power Constraints
    (2010) Swedish SoC Conference 2010
- Contribution to conference › Paper, not in proceeding
 
 
