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- 2024
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Mark
A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu6Sn5
(
- Contribution to journal › Article
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Mark
Diffusion Bonding 321-Grade Stainless Steel : Failure and Multimodal Characterization
2024) In Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada 30(2). p.192-199(
- Contribution to journal › Article
- 2020
-
Mark
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
(
- Contribution to journal › Article
- 2019
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Mark
Scanning 3DXRD measurement of grain growth, stress, and formation of Cu6Sn5 around a tin whisker during heat treatment
(
- Contribution to journal › Article
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Mark
Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction
(
- Contribution to journal › Article
- 2018
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Mark
Evidence of 3D strain gradients associated with tin whisker growth
(
- Contribution to journal › Article
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Mark
Tin whiskers: experiments and modelling
2018)(
- Thesis › Doctoral thesis (compilation)