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Diffusion Bonding 321-Grade Stainless Steel : Failure and Multimodal Characterization

Lazar, Isac LU orcid ; Knutsson, Axel LU ; Romero, Hector Pous ; Hektor, Johan LU ; Bushlya, Volodymyr LU ; Mikkelsen, Anders LU and Lenrick, Filip LU orcid (2024) In Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada 30(2). p.192-199
Abstract

Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an... (More)

Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an interaction between Ti(C, N) and Al/Mg-oxide precipitates at the bond line is observed, where Ti(C, N) nucleates on the oxides forming a core-shell structure. The results indicate that small amounts of particular alloying elements can greatly impact diffusion bond quality, prompting further research into the microstructural evolution that occurs during bonding conditions.

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Please use this url to cite or link to this publication:
author
; ; ; ; ; and
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
core-shell, diffusion bonding, microstructure, PEEM, stainless steel, TEM, Ti-rich precipitation
in
Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada
volume
30
issue
2
pages
8 pages
publisher
Cambridge University Press
external identifiers
  • pmid:38525879
  • scopus:85191730427
ISSN
1435-8115
DOI
10.1093/mam/ozae019
language
English
LU publication?
yes
additional info
Publisher Copyright: © The Author(s) 2024. Published by Oxford University Press on behalf of the Microscopy Society of America.
id
d916f7ac-62c7-4d11-96b6-de2d669f2ce9
date added to LUP
2024-05-13 11:28:24
date last changed
2024-05-27 13:16:41
@article{d916f7ac-62c7-4d11-96b6-de2d669f2ce9,
  abstract     = {{<p>Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an interaction between Ti(C, N) and Al/Mg-oxide precipitates at the bond line is observed, where Ti(C, N) nucleates on the oxides forming a core-shell structure. The results indicate that small amounts of particular alloying elements can greatly impact diffusion bond quality, prompting further research into the microstructural evolution that occurs during bonding conditions.</p>}},
  author       = {{Lazar, Isac and Knutsson, Axel and Romero, Hector Pous and Hektor, Johan and Bushlya, Volodymyr and Mikkelsen, Anders and Lenrick, Filip}},
  issn         = {{1435-8115}},
  keywords     = {{core-shell; diffusion bonding; microstructure; PEEM; stainless steel; TEM; Ti-rich precipitation}},
  language     = {{eng}},
  number       = {{2}},
  pages        = {{192--199}},
  publisher    = {{Cambridge University Press}},
  series       = {{Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada}},
  title        = {{Diffusion Bonding 321-Grade Stainless Steel : Failure and Multimodal Characterization}},
  url          = {{http://dx.doi.org/10.1093/mam/ozae019}},
  doi          = {{10.1093/mam/ozae019}},
  volume       = {{30}},
  year         = {{2024}},
}