Diffusion Bonding 321-Grade Stainless Steel : Failure and Multimodal Characterization
(2024) In Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada 30(2). p.192-199- Abstract
Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an... (More)
Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an interaction between Ti(C, N) and Al/Mg-oxide precipitates at the bond line is observed, where Ti(C, N) nucleates on the oxides forming a core-shell structure. The results indicate that small amounts of particular alloying elements can greatly impact diffusion bond quality, prompting further research into the microstructural evolution that occurs during bonding conditions.
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- author
- Lazar, Isac LU ; Knutsson, Axel LU ; Romero, Hector Pous ; Hektor, Johan LU ; Bushlya, Volodymyr LU ; Mikkelsen, Anders LU and Lenrick, Filip LU
- organization
- publishing date
- 2024-04
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- core-shell, diffusion bonding, microstructure, PEEM, stainless steel, TEM, Ti-rich precipitation
- in
- Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada
- volume
- 30
- issue
- 2
- pages
- 8 pages
- publisher
- Cambridge University Press
- external identifiers
-
- pmid:38525879
- scopus:85191730427
- ISSN
- 1435-8115
- DOI
- 10.1093/mam/ozae019
- language
- English
- LU publication?
- yes
- additional info
- Publisher Copyright: © The Author(s) 2024. Published by Oxford University Press on behalf of the Microscopy Society of America.
- id
- d916f7ac-62c7-4d11-96b6-de2d669f2ce9
- date added to LUP
- 2024-05-13 11:28:24
- date last changed
- 2024-05-27 13:16:41
@article{d916f7ac-62c7-4d11-96b6-de2d669f2ce9, abstract = {{<p>Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to be caused by Ti(C, N) precipitation at the bond line. Through in situ studies, it is found that Ti diffuses from the bulk to the mating surfaces at high temperatures. The Ti subsequently precipitates and, for the first time, an interaction between Ti(C, N) and Al/Mg-oxide precipitates at the bond line is observed, where Ti(C, N) nucleates on the oxides forming a core-shell structure. The results indicate that small amounts of particular alloying elements can greatly impact diffusion bond quality, prompting further research into the microstructural evolution that occurs during bonding conditions.</p>}}, author = {{Lazar, Isac and Knutsson, Axel and Romero, Hector Pous and Hektor, Johan and Bushlya, Volodymyr and Mikkelsen, Anders and Lenrick, Filip}}, issn = {{1435-8115}}, keywords = {{core-shell; diffusion bonding; microstructure; PEEM; stainless steel; TEM; Ti-rich precipitation}}, language = {{eng}}, number = {{2}}, pages = {{192--199}}, publisher = {{Cambridge University Press}}, series = {{Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada}}, title = {{Diffusion Bonding 321-Grade Stainless Steel : Failure and Multimodal Characterization}}, url = {{http://dx.doi.org/10.1093/mam/ozae019}}, doi = {{10.1093/mam/ozae019}}, volume = {{30}}, year = {{2024}}, }