SPI: Sustainable Production Initiative
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- 2025
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Mark
Gradient Structure Evolution During Sintering of WC-TiC-Co Cemented Carbides
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- Contribution to journal › Article
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Wear properties of cemented carbides with new binder solutions for rock drilling inserts
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- Contribution to journal › Article
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Influence of the design of Ti (C, N)-based cermets with alternative binders on their performance and wear in milling
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- Contribution to journal › Article
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Enhancing Core Loss Tracking Accuracy in Stator Cores : A Comparative Assessment of Static and Dynamic Jiles-Atherton Model Formulations
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- Contribution to journal › Article
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Mark
Optimal modelling of Colding parameters for round inserts with respect to tool use-time criteria
2025) 20th CIRP Conference on Modeling of Machining Operations in Mons, CIRP CMMO 2025 In Procedia CIRP 133. p.286-291(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
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Mark
A physics-based flow stress model for cutting simulation of additively manufactured Alloy 718
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- Contribution to journal › Article
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Sub-surface sinking effect of reinforcement particle in laser assisted machining of metal matrix composites
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- Contribution to journal › Article
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Exploring the nanoscale mechanisms of Ni-P system to examine the suitability as joining material for high temperature applications
2025) The 14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding In DVS Berichte 399. p.212-221(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
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Mark
Dephosphorization of copper phosphide to copper
2025) The 14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding In DVS Berichte 399. p.340-343(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
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Mark
Synchrotron X-ray study of vacuum brazed 316L stainless steel joints
2025) The 14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding In DVS Berichte 399. p.114-119(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding