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Dephosphorization of copper phosphide to copper

Rajashekar, P. LU ; Bhattacharya, R. LU ; Ek, M. LU orcid and Lenrick, F. LU orcid (2025) The 14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding In DVS Berichte 399. p.340-343
Abstract
The formation of copper phosphide phases during brazing can negatively impact the mechanical properties of copper joints and the overall performance of the resulting product. For instance, copper tubes in air conditioning heat exchangers are brazed using Cu-P filler alloy, resulting in unnecessary brittle Cu₃P compounds. This study investigates a novel process of dephosphorization of copper phosphide nanoparticles to pure copper nanoparticles under a high vacuum, focusing on the temperature dependency on the phosphorus removal rate. Using energy-dispersive X-ray spectroscopy (EDX) and environmental transmission microscopy (ETEM), we quantify phosphorus loss at 500°C, 600°C, and 700°C experiments. There was no phosphorus loss at 500°C... (More)
The formation of copper phosphide phases during brazing can negatively impact the mechanical properties of copper joints and the overall performance of the resulting product. For instance, copper tubes in air conditioning heat exchangers are brazed using Cu-P filler alloy, resulting in unnecessary brittle Cu₃P compounds. This study investigates a novel process of dephosphorization of copper phosphide nanoparticles to pure copper nanoparticles under a high vacuum, focusing on the temperature dependency on the phosphorus removal rate. Using energy-dispersive X-ray spectroscopy (EDX) and environmental transmission microscopy (ETEM), we quantify phosphorus loss at 500°C, 600°C, and 700°C experiments. There was no phosphorus loss at 500°C experiment, setting a threshold temperature below which phosphorus remains stable. For the 600°C experiment, phosphorus was gradually removed over time, while nearly complete dephosphorization occurred quickly for the 700°C experiment. These findings provide a promising approach to eliminating brittle Cu₃P compounds in Cu-P brazed joints, potentially improving their mechanical performance in industrial applications. (Less)
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author
; ; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
Metal phosphide, In-situ TEM experiment, CVD, Copper phosphide, Environmental transmission electron microscope, Brazing, Joining, Bonding, Gas actuated bonding, High resolution transmission electron microscopy (HRTEM), Energy dispersive X-ray spectroscopy
host publication
Brazing, high temperature brazing and diffusion bonding : LÖT 2025 - LÖT 2025
series title
DVS Berichte
volume
399
article number
4
edition
DVS Berichte
pages
4 pages
publisher
DVS Media GmbH, Düsseldorf 2025, Printing by WirmachenDruck GmbH, Backnang
conference name
The 14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding
conference location
Aachen, Germany
conference dates
2025-06-24 - 2025-06-26
ISSN
0418-9639
ISBN
978-3-96144-294-2
978-3-96144-295-9
DOI
10.53192/LOET20250340
language
English
LU publication?
yes
id
11a7e4f9-46b3-4ce9-8d03-174c3b34d36a
date added to LUP
2025-08-30 11:17:50
date last changed
2025-09-18 09:42:58
@inproceedings{11a7e4f9-46b3-4ce9-8d03-174c3b34d36a,
  abstract     = {{The formation of copper phosphide phases during brazing can negatively impact the mechanical properties of copper joints and the overall performance of the resulting product. For instance, copper tubes in air conditioning heat exchangers are brazed using Cu-P filler alloy, resulting in unnecessary brittle Cu₃P compounds. This study investigates a novel process of dephosphorization of copper phosphide nanoparticles to pure copper nanoparticles under a high vacuum, focusing on the temperature dependency on the phosphorus removal rate. Using energy-dispersive X-ray spectroscopy (EDX) and environmental transmission microscopy (ETEM), we quantify phosphorus loss at 500°C, 600°C, and 700°C experiments. There was no phosphorus loss at 500°C experiment, setting a threshold temperature below which phosphorus remains stable. For the 600°C experiment, phosphorus was gradually removed over time, while nearly complete dephosphorization occurred quickly for the 700°C experiment. These findings provide a promising approach to eliminating brittle Cu₃P compounds in Cu-P brazed joints, potentially improving their mechanical performance in industrial applications.}},
  author       = {{Rajashekar, P. and Bhattacharya, R. and Ek, M. and Lenrick, F.}},
  booktitle    = {{Brazing, high temperature brazing and diffusion bonding : LÖT 2025}},
  isbn         = {{978-3-96144-294-2}},
  issn         = {{0418-9639}},
  keywords     = {{Metal phosphide; In-situ TEM experiment; CVD; Copper phosphide; Environmental transmission electron microscope; Brazing; Joining; Bonding; Gas actuated bonding; High resolution transmission electron microscopy (HRTEM); Energy dispersive X-ray spectroscopy}},
  language     = {{eng}},
  pages        = {{340--343}},
  publisher    = {{DVS Media GmbH, Düsseldorf  2025, Printing by WirmachenDruck GmbH, Backnang}},
  series       = {{DVS Berichte}},
  title        = {{Dephosphorization of copper phosphide to copper}},
  url          = {{http://dx.doi.org/10.53192/LOET20250340}},
  doi          = {{10.53192/LOET20250340}},
  volume       = {{399}},
  year         = {{2025}},
}