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Exploring novel joining technique of Gas Actuated Bonding by utilizing In-situ Environmental-TEM

Bhattacharya, Rahul LU ; Ek, Martin LU orcid and Lenrick, Filip LU orcid (2024) The 17th European Microscopy Congress Copenhagen Denmark 129.
Abstract
The reliability of a critical industrial component is decided by the durability of the weakest joint or spot. For applications involving high-temperature operational conditions especially coupled with corrosive environments like fuel cell interconnections, molten metal baths, etc., the joints are the most vulnerable regions for catastrophic failure due to localized material degradation by selective corrosion leading to compromised mechanical behavior. The existing joining techniques lead to a continuous metallic phase with modified microstructural characteristics at the bridging junctures or employ a joining alloy that integrates two parent materials. These bridging phases are proving to be the weakest points of the components because they... (More)
The reliability of a critical industrial component is decided by the durability of the weakest joint or spot. For applications involving high-temperature operational conditions especially coupled with corrosive environments like fuel cell interconnections, molten metal baths, etc., the joints are the most vulnerable regions for catastrophic failure due to localized material degradation by selective corrosion leading to compromised mechanical behavior. The existing joining techniques lead to a continuous metallic phase with modified microstructural characteristics at the bridging junctures or employ a joining alloy that integrates two parent materials. These bridging phases are proving to be the weakest points of the components because they are prone to corrosion compared to parent materials. This is effectuated by the microstructural transformation as well as local compositional fluctuation incorporated in the bridging phases as a consequence of the joining techniques and procedure currently in use. On the other hand, the semiconductor industry utilizes emerging brazing technologies built on well-established Chemical Vapor Transfer (CVT) technologies (e.g., CVD, MOVPE, PVD). Even though both oxide removal and metal migration into the gap are crucial in metal bonding, there is only one published concept for delivery of non-metallic MPD, and a few studies of utilizing active gases for oxide removal. (Less)
Please use this url to cite or link to this publication:
author
; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
In-Situ TEM, Deoxidation, Gas Actuated Bonding
host publication
BIO Web of Conferences
editor
Qvortrup, K. and Weede, K.
volume
129
article number
23004
pages
2 pages
publisher
EDP Sciences
conference name
The 17th European Microscopy Congress Copenhagen Denmark
conference location
Copenhagen, Denmark
conference dates
2024-08-25 - 2024-08-30
DOI
10.1051/bioconf/202412923004
language
English
LU publication?
yes
id
7d2651a1-d670-45fe-b708-a3317d39a2cc
date added to LUP
2025-08-28 17:47:56
date last changed
2025-09-23 10:14:19
@inproceedings{7d2651a1-d670-45fe-b708-a3317d39a2cc,
  abstract     = {{The reliability of a critical industrial component is decided by the durability of the weakest joint or spot. For applications involving high-temperature operational conditions especially coupled with corrosive environments like fuel cell interconnections, molten metal baths, etc., the joints are the most vulnerable regions for catastrophic failure due to localized material degradation by selective corrosion leading to compromised mechanical behavior. The existing joining techniques lead to a continuous metallic phase with modified microstructural characteristics at the bridging junctures or employ a joining alloy that integrates two parent materials. These bridging phases are proving to be the weakest points of the components because they are prone to corrosion compared to parent materials. This is effectuated by the microstructural transformation as well as local compositional fluctuation incorporated in the bridging phases as a consequence of the joining techniques and procedure currently in use. On the other hand, the semiconductor industry utilizes emerging brazing technologies built on well-established Chemical Vapor Transfer (CVT) technologies (e.g., CVD, MOVPE, PVD). Even though both oxide removal and metal migration into the gap are crucial in metal bonding, there is only one published concept for delivery of non-metallic MPD, and a few studies of utilizing active gases for oxide removal.}},
  author       = {{Bhattacharya, Rahul and Ek, Martin and Lenrick, Filip}},
  booktitle    = {{BIO Web of Conferences}},
  editor       = {{Qvortrup, K. and Weede, K.}},
  keywords     = {{In-Situ TEM; Deoxidation; Gas Actuated Bonding}},
  language     = {{eng}},
  month        = {{10}},
  publisher    = {{EDP Sciences}},
  title        = {{Exploring novel joining technique of Gas Actuated Bonding by utilizing In-situ Environmental-TEM}},
  url          = {{http://dx.doi.org/10.1051/bioconf/202412923004}},
  doi          = {{10.1051/bioconf/202412923004}},
  volume       = {{129}},
  year         = {{2024}},
}